Bumili FPF2281BUCX_F130 sa BYCHPS
Bumili na may garantiya
FPF2281BUCX_F130
- Numero ng Bahagi:
- FPF2281BUCX_F130
- Manufacturer:
- Fairchild/ON Semiconductor
- Paglalarawan:
- IC LOAD SWITCH
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16071 Pieces
- Data sheet:
- FPF2281BUCX_F130.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FPF2281BUCX_F130, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FPF2281BUCX_F130 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | Not Required |
|---|---|
| Boltahe - I-load: | 2.5 V ~ 13.5 V |
| Lumipat Uri: | General Purpose |
| Supplier aparato Package: | 12-WLCSP (1.29x1.83) |
| serye: | - |
| Rds On (Typ): | - |
| Ratio - Input: Output: | 1:1 |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 12-UFBGA, WLCSP |
| Type output: | N-Channel |
| output Configuration: | High Side |
| Ibang pangalan: | FPF2281BUCX_F130TR |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng mga Outputs: | 1 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 6 Weeks |
| Manufacturer Bilang Bahagi: | FPF2281BUCX_F130 |
| interface: | On/Off |
| Type input: | Non-Inverting |
| Mga tampok: | Power Good |
| fault Protection: | Over Temperature, Over Voltage |
| paglalarawan: | IC LOAD SWITCH |
| Current - Output (Max): | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FPF2281BUCX_F130
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers