Bumili FSBB30CH60F sa BYCHPS
Bumili na may garantiya
FSBB30CH60F
- Numero ng Bahagi:
- FSBB30CH60F
- Manufacturer:
- Fairchild/ON Semiconductor
- Paglalarawan:
- IC SMART PWR MODULE SPM27-EA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18699 Pieces
- Data sheet:
- FSBB30CH60F.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FSBB30CH60F, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FSBB30CH60F sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 2500Vrms |
|---|---|
| Boltahe: | 600V |
| uri: | IGBT |
| serye: | Motion-SPM® |
| Package / Kaso: | 27-PowerDIP Module (1.205", 30.60mm) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | FSBB30CH60F |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 3 Phase 600V 30A 27-PowerDIP Module (1.205", 30.60mm) |
| paglalarawan: | IC SMART PWR MODULE SPM27-EA |
| kasalukuyan: | 30A |
| configuration: | 3 Phase |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FSBB30CH60F
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
FSBB30CH60C | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMCC | Pagtatanong |
 |
FSBB30CH60DF | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMPA | Pagtatanong |
 |
FSBB30CH60D | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMPA | Pagtatanong |
|
FSBB30CH60B | Fairchild/ON Semiconductor | MODULE SPM 600V 30A 3PH SPM27-EC | Pagtatanong |
 |
FSBB30CH60 | Fairchild/ON Semiconductor | SMART POWER MODULE 30A SPM27-EA | Pagtatanong |
 |
FSBB30CH60CT | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMEC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers