Bumili FT602Q-T sa BYCHPS
Bumili na may garantiya
FT602Q-T
- Numero ng Bahagi:
- FT602Q-T
- Manufacturer:
- FTDI (Future Technology Devices International, Ltd.)
- Paglalarawan:
- IC USB3-32BIT SYNC FIFO 76QFN
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18506 Pieces
- Data sheet:
- FT602Q-T.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa FT602Q-T, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa FT602Q-T sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.8V, 2.5V, 3.3V |
|---|---|
| Supplier aparato Package: | 76-QFN (9x9) |
| pamantayan: | USB 3.0 |
| serye: | - |
| protokol: | USB |
| packaging: | Tray |
| Package / Kaso: | 76-VFQFN Exposed Pad |
| Ibang pangalan: | 768-1313 |
| operating Temperature: | -40°C ~ 85°C |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | FT602Q-T |
| interface: | USB |
| tungkulin: | Bridge, USB to FIFO |
| Ang pinalawak Paglalarawan: | USB Bridge, USB to FIFO USB 3.0 USB Interface 76-QFN (9x9) |
| paglalarawan: | IC USB3-32BIT SYNC FIFO 76QFN |
| Current - Supply: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa FT602Q-T
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
USB5826T/KD | Microchip Technology | IC HUB CONTROLLER USB 100VQFN | Pagtatanong |
 |
KSZ8463RLI | Microchip Technology | IC ETHERNET SWITCH 10/100 64LQFP | Pagtatanong |
 |
ADM6992X-AD-T-1 | Infineon Technologies | IC ETHERNET CONVERTER 128QFP | Pagtatanong |
 |
LAN9117-MT | Microchip Technology | IC ETHERNET CTRLR 10/100 100TQFP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers