Bumili G2RV-SL700 DC24 (DC21) sa BYCHPS
Bumili na may garantiya
G2RV-SL700 DC24 (DC21)
- Numero ng Bahagi:
- G2RV-SL700 DC24 (DC21)
- Manufacturer:
- Omron Automation & Safety
- Paglalarawan:
- RELAY GEN PURPOSE SPDT 6A 24V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12515 Pieces
- Data sheet:
- G2RV-SL700 DC24 (DC21).pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa G2RV-SL700 DC24 (DC21), mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa G2RV-SL700 DC24 (DC21) sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 19.2 VDC |
|---|---|
| I-off ang Boltahe (Min): | 2.4 VDC |
| pagwawakas Style: | Screw Terminal |
| Paglipat Boltahe: | 440VAC, 125VDC - Max |
| serye: | G2RV |
| release Time: | 40ms |
| Type relay: | General Purpose with Socket |
| packaging: | Bulk |
| Ibang pangalan: | G2RV-SL700-DC24 G2RV-SL700-DC24DC21 G2RVSL700DC24 G2RVSL700DC24DC21 Z2535 |
| operating Temperature: | -40°C ~ 55°C |
| Magpapatakbo Time: | 20ms |
| Salalayan Type: | DIN Rail |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | G2RV-SL700 DC24 (DC21) |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | General Purpose with Socket Relay SPDT (1 Form C) 24VDC Coil DIN Rail |
| paglalarawan: | RELAY GEN PURPOSE SPDT 6A 24V |
| Contact Rating (Kasalukuyang): | 6A |
| Contact Material: | - |
| Contact Form: | SPDT (1 Form C) |
| Coil Boltahe: | 24VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | - |
| Coil Power: | 300 mW |
| Coil Kasalukuyang: | 13.3mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa G2RV-SL700 DC24 (DC21)
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers