Bumili G70A-ZIM16-5-DC24V sa BYCHPS
Bumili na may garantiya
G70A-ZIM16-5-DC24V
- Numero ng Bahagi:
- G70A-ZIM16-5-DC24V
- Manufacturer:
- Omron Automation & Safety
- Paglalarawan:
- RELAY BLOCK 110VDC INPUT BASE
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16596 Pieces
- Data sheet:
- G70A-ZIM16-5-DC24V.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa G70A-ZIM16-5-DC24V, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa G70A-ZIM16-5-DC24V sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | * |
|---|---|
| Ibang pangalan: | G70AZIM165DC24V |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 21 Weeks |
| Manufacturer Bilang Bahagi: | G70A-ZIM16-5-DC24V |
| Ang pinalawak Paglalarawan: | |
| paglalarawan: | RELAY BLOCK 110VDC INPUT BASE |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa G70A-ZIM16-5-DC24V
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
G70A-ZOC16-3 DC24 | Omron Automation and Safety | RELAY BLOCK 10AMP OUT BASE NPN | Pagtatanong |
 |
26532731 | Crouzet | LOT 10 FUSES GMS 5A | Pagtatanong |
 |
RP28500 | TE Connectivity Potter & Brumfield Relays | METAL RETAINING CLIP RT RP RY | Pagtatanong |
|
G70A-ZOC16-4 DC24 | Omron Automation and Safety | RELAY BLOCK 10AMP OUT BASE PNP | Pagtatanong |
|
J73KN-B-01 | Omron Automation and Safety | CONTACTS AUX 1NC FRONT MOUNTING | Pagtatanong |
|
Y92B-P200 | Omron Automation and Safety | HEAT SINK 0.43DEGC/W FOR G3PB | Pagtatanong |
 |
1784270000 | Weidmuller | JUMPER ZQV 2.5N 1/4-2 BLACK | Pagtatanong |
|
Y92B-S10 | Omron Automation and Safety | HEAT SINK FOR G3S4 | Pagtatanong |
 |
670-0154 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET | Pagtatanong |
 |
2907060 | Phoenix Contact | RIF-BR-12-230 AC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers