Bumili GA400TD25S sa BYCHPS
Bumili na may garantiya
GA400TD25S
- Numero ng Bahagi:
- GA400TD25S
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- IGBT FAST 250V 400A INT-A-PAK
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 16740 Pieces
- Data sheet:
- GA400TD25S.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa GA400TD25S, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa GA400TD25S sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 250V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 1.6V @ 15V, 400A |
| Supplier aparato Package: | Dual INT-A-PAK |
| serye: | - |
| Power - Max: | 1350W |
| Package / Kaso: | Dual INT-A-PAK (3 + 8) |
| Ibang pangalan: | *GA400TD25S VS-GA400TD25S VS-GA400TD25S-ND VSGA400TD25S VSGA400TD25S-ND |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | GA400TD25S |
| Input Kapasidad (CIEs) @ Vce: | 36nF @ 30V |
| input: | Standard |
| Type IGBT: | - |
| Ang pinalawak Paglalarawan: | IGBT Module Half Bridge 250V 400A 1350W Chassis Mount Dual INT-A-PAK |
| paglalarawan: | IGBT FAST 250V 400A INT-A-PAK |
| Current - Kolektor Cutoff (Max): | 500µA |
| Current - kolektor (Ic) (Max): | 400A |
| configuration: | Half Bridge |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa GA400TD25S
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
CM150DX-24A | Powerex Inc. | IGBT MOD DUAL 1200V 150A NX SER | Pagtatanong |
 |
APTGF50H60T3G | Microsemi Corporation | POWER MODULE IGBT 600V 50A SP3 | Pagtatanong |
 |
APTGF25DDA120T3G | Microsemi Corporation | IGBT MODULE NPT DL BST CHOP SP3 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers