Bumili HBS508M2JZ sa BYCHPS
Bumili na may garantiya
HBS508M2JZ
- Numero ng Bahagi:
- HBS508M2JZ
- Manufacturer:
- AMP Connectors / TE Connectivity
- Paglalarawan:
- RES 8.20M OHM 3W 5% RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18031 Pieces
- Data sheet:
- 1.HBS508M2JZ.pdf2.HBS508M2JZ.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa HBS508M2JZ, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa HBS508M2JZ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| pagpapaubaya: | ±5% |
|---|---|
| temperatura koepisyent: | ±100ppm/°C |
| Supplier aparato Package: | Radial Lead |
| Sukat / Dimension: | 1.969" L x 0.039" W (50.00mm x 1.00mm) |
| serye: | HBS, CGS |
| Resistance (Ohms): | 8.2M |
| Power (Watts): | 3W |
| packaging: | Bulk |
| Package / Kaso: | Radial |
| Ibang pangalan: | 1676790-2 1676790-2-ND |
| operating Temperature: | -55°C ~ 125°C |
| Bilang ng mga Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | HBS508M2JZ |
| Taas - Makaupo (Max): | 0.512" (13.00mm) |
| Mga tampok: | High Voltage, Non-Inductive |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 8.2M Ohm ±5% 3W Through Hole Resistor Radial High Voltage, Non-Inductive Thick Film |
| paglalarawan: | RES 8.20M OHM 3W 5% RADIAL |
| komposisyon: | Thick Film |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa HBS508M2JZ
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers