Bumili HFA100MD60D sa BYCHPS
Bumili na may garantiya
HFA100MD60D
- Numero ng Bahagi:
- HFA100MD60D
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- DIODE MODULE 600V 83A TO244AB
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18266 Pieces
- Data sheet:
- HFA100MD60D.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa HFA100MD60D, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa HFA100MD60D sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 1.4V @ 50A |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 600V |
| Supplier aparato Package: | TO-244AB (Isolated) |
| bilis: | Fast Recovery = 200mA (Io) |
| serye: | HEXFRED® |
| Reverse Recovery Time (trr): | 115ns |
| packaging: | Bulk |
| Package / Kaso: | TO-244AB Isolated Tab |
| Ibang pangalan: | *HFA100MD60D |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | HFA100MD60D |
| Ang pinalawak Paglalarawan: | Diode Array 1 Pair Series Connection Standard 600V 83A (DC) Chassis Mount TO-244AB Isolated Tab |
| Type diode: | Standard |
| diode Configuration: | 1 Pair Series Connection |
| paglalarawan: | DIODE MODULE 600V 83A TO244AB |
| Current - Reverse pagtagas @ Vr: | 20µA @ 600V |
| Kasalukuyang - Average rectified (Io) (per Diode): | 83A (DC) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa HFA100MD60D
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers