Bumili HFB075025-000 sa BYCHPS
Bumili na may garantiya
HFB075025-000
- Numero ng Bahagi:
- HFB075025-000
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Paglalarawan:
- FERRITE CORE 157 OHM SOLID
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16588 Pieces
- Data sheet:
- 1.HFB075025-000.pdf2.HFB075025-000.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa HFB075025-000, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa HFB075025-000 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Round |
|---|---|
| serye: | HF |
| Ratings: | - |
| Outer Dimensyon: | 0.295" Dia (7.50mm) |
| Salalayan Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| materyal: | HF |
| Tagagawa Standard Lead Time: | 9 Weeks |
| Manufacturer Bilang Bahagi: | HFB075025-000 |
| Haba: | 0.787" (20.00mm) |
| Inner Dimensyon: | 0.094" Dia (2.39mm) |
| Impedance @ Frequency: | 157 Ohm @ 300MHz |
| Ang pinalawak Paglalarawan: | Solid Free Hanging Ferrite Core 157 Ohm @ 300MHz ID 0.094" Dia (2.39mm) OD 0.295" Dia (7.50mm) Length 0.787" (20.00mm) |
| disenyo: | Solid |
| paglalarawan: | FERRITE CORE 157 OHM SOLID |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa HFB075025-000
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
28B0686-100 | Laird-Signal Integrity Products | FERRITE CORE 139 OHM SOLID | Pagtatanong |
 |
7427801 | Wurth Electronics Inc. | FERRITE CORE 79 OHM SOLID | Pagtatanong |
 |
FSRB060040RNB00B | Murata Electronics North America | FERRITE CORE 290 OHM SOLID 2.7MM | Pagtatanong |
 |
HFB075024-000 | Laird-Signal Integrity Products | FERRITE CORE 124 OHM SOLID 2.4MM | Pagtatanong |
 |
ESD-R-25S | KEMET | FERRITE CORE SOLID 15MM | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers