Bumili HHXB630ARA330MHA0G sa BYCHPS
Bumili na may garantiya
HHXB630ARA330MHA0G
- Numero ng Bahagi:
- HHXB630ARA330MHA0G
- Manufacturer:
- Nippon Chemi-Con
- Paglalarawan:
- CAP ALUM POLY HYB 33UF 63V SMD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15608 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa HHXB630ARA330MHA0G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa HHXB630ARA330MHA0G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 63V |
|---|---|
| uri: | Hybrid |
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | 0.327" L x 0.327" W (8.30mm x 8.30mm) |
| Sukat / Dimension: | 0.315" Dia (8.00mm) |
| serye: | Automotive, AEC-Q200, HXB |
| Ripple Kasalukuyang - Mababang Dalas: | - |
| Ripple Kasalukuyang - Mataas na Dalas: | 1.6A @ 100kHz |
| packaging: | Original-Reel® |
| Package / Kaso: | Radial, Can - SMD |
| Ibang pangalan: | 565-4193-6 |
| operating Temperature: | -55°C ~ 105°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | HHXB630ARA330MHA0G |
| Lifetime @ Temp.: | 5000 Hrs @ 105°C |
| Lead Spacing: | - |
| impedance: | - |
| Taas - Makaupo (Max): | 0.406" (10.30mm) |
| Ang pinalawak Paglalarawan: | 33µF ±20% 63V Aluminum Polymer Capacitor Radial, Can - SMD 40 mOhm 5000 Hrs @ 105°C |
| ESR (Katumbas Series pagtutol): | 40 mOhm |
| paglalarawan: | CAP ALUM POLY HYB 33UF 63V SMD |
| kapasidad: | 33µF |
| aplikasyon: | Automotive |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa HHXB630ARA330MHA0G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers