Bumili HL2-HTM-AC120V-F sa BYCHPS
Bumili na may garantiya
HL2-HTM-AC120V-F
- Numero ng Bahagi:
- HL2-HTM-AC120V-F
- Manufacturer:
- Panasonic
- Paglalarawan:
- RELAY GEN PURPOSE DPDT 10A 120V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13654 Pieces
- Data sheet:
- 1.HL2-HTM-AC120V-F.pdf2.HL2-HTM-AC120V-F.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa HL2-HTM-AC120V-F, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa HL2-HTM-AC120V-F sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 96 VAC |
|---|---|
| I-off ang Boltahe (Min): | 36 VAC |
| pagwawakas Style: | Quick Connect - 0.187" (4.7mm) |
| Paglipat Boltahe: | 125VAC - Nom |
| serye: | HL |
| release Time: | 25ms |
| Type relay: | General Purpose |
| packaging: | Bulk |
| Ibang pangalan: | 255-3630 HL2HTMAC120VF |
| operating Temperature: | -50°C ~ 70°C |
| Magpapatakbo Time: | 25ms |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | HL2-HTM-AC120V-F |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | General Purpose Relay DPDT (2 Form C) 120VAC Coil Chassis Mount |
| paglalarawan: | RELAY GEN PURPOSE DPDT 10A 120V |
| Contact Rating (Kasalukuyang): | 10A |
| Contact Material: | Silver Tin Oxide (AgSnO) |
| Contact Form: | DPDT (2 Form C) |
| Coil Boltahe: | 120VAC |
| Coil Type: | Non Latching |
| Coil Resistance: | - |
| Coil Power: | 1.2 VA |
| Coil Kasalukuyang: | 10mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa HL2-HTM-AC120V-F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers