Bumili HZC157M035F24T-F sa BYCHPS
Bumili na may garantiya
HZC157M035F24T-F
- Numero ng Bahagi:
- HZC157M035F24T-F
- Manufacturer:
- Cornell Dubilier Electronics
- Paglalarawan:
- CAP ALUM POLY 150UF 20% 35V SMD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14690 Pieces
- Data sheet:
- HZC157M035F24T-F.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa HZC157M035F24T-F, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa HZC157M035F24T-F sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 35V |
|---|---|
| uri: | Hybrid |
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | 0.327" L x 0.327" W (8.30mm x 8.30mm) |
| Sukat / Dimension: | 0.315" Dia (8.00mm) |
| serye: | HZC |
| Ripple Kasalukuyang - Mababang Dalas: | 160mA @ 120Hz |
| Ripple Kasalukuyang - Mataas na Dalas: | 1.6A @ 100kHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | Radial, Can - SMD |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | HZC157M035F24T-F |
| Lifetime @ Temp.: | 4000 Hrs @ 125°C |
| Lead Spacing: | - |
| impedance: | - |
| Taas - Makaupo (Max): | 0.413" (10.50mm) |
| Ang pinalawak Paglalarawan: | 150µF ±20% 35V Aluminum Polymer Capacitor Radial, Can - SMD 27 mOhm 4000 Hrs @ 125°C |
| ESR (Katumbas Series pagtutol): | 27 mOhm |
| paglalarawan: | CAP ALUM POLY 150UF 20% 35V SMD |
| kapasidad: | 150µF |
| aplikasyon: | Automotive, Bypass, Decoupling |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa HZC157M035F24T-F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers