Bumili IFCM20T65GDXKMA1 sa BYCHPS
Bumili na may garantiya
IFCM20T65GDXKMA1
- Numero ng Bahagi:
- IFCM20T65GDXKMA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- IGBT 650V 20A 24-MDIP-24
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17949 Pieces
- Data sheet:
- IFCM20T65GDXKMA1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa IFCM20T65GDXKMA1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa IFCM20T65GDXKMA1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 2000Vrms |
|---|---|
| Boltahe: | 650V |
| uri: | IGBT |
| serye: | CIPOS™ |
| Package / Kaso: | 24-PowerDIP Module (1.028", 26.10mm) |
| Ibang pangalan: | SP001333972 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | IFCM20T65GDXKMA1 |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 2 Phase 650V 20A 24-PowerDIP Module (1.028", 26.10mm) |
| paglalarawan: | IGBT 650V 20A 24-MDIP-24 |
| kasalukuyan: | 20A |
| configuration: | 2 Phase |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa IFCM20T65GDXKMA1
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
IFCM20U65GDXKMA1 | Infineon Technologies | IGBT 650V 20A 24-MDIP-24 | Pagtatanong |
 |
PM150RL1B060 | Powerex Inc. | MOD IPM 7-PAC L1 150A 600V | Pagtatanong |
 |
FSB50325T | Fairchild/ON Semiconductor | MODULE SPM 250V 3A SPM23-AC | Pagtatanong |
|
IRAM256-1567A2 | Infineon Technologies | IC MOD PWR HYBRID 600V 15A | Pagtatanong |
 |
FPAM30LH60 | Fairchild/ON Semiconductor | MODULE SPM 600V 30A S32EA | Pagtatanong |
|
PM50RVA120 | Powerex Inc. | MOD IPM 7PAC 1200V 50A | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers