Bumili IXGN200N60A sa BYCHPS
Bumili na may garantiya
IXGN200N60A
- Numero ng Bahagi:
- IXGN200N60A
- Manufacturer:
- IXYS Corporation
- Paglalarawan:
- IGBT 300A 600V SOT-227B
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14714 Pieces
- Data sheet:
- IXGN200N60A.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa IXGN200N60A, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa IXGN200N60A sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 2.7V @ 15V, 100A |
| Supplier aparato Package: | SOT-227B |
| serye: | HiPerFAST™ |
| Power - Max: | 600W |
| Package / Kaso: | SOT-227-4, miniBLOC |
| operating Temperature: | -55°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | IXGN200N60A |
| Input Kapasidad (CIEs) @ Vce: | 9nF @ 25V |
| input: | Standard |
| Type IGBT: | - |
| Ang pinalawak Paglalarawan: | IGBT Module Single 600V 200A 600W Chassis Mount SOT-227B |
| paglalarawan: | IGBT 300A 600V SOT-227B |
| Current - Kolektor Cutoff (Max): | 200µA |
| Current - kolektor (Ic) (Max): | 200A |
| configuration: | Single |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa IXGN200N60A
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
IXGN200N60A2 | IXYS | IGBT 600V 200A SOT-227B | Pagtatanong |
|
IXGN200N60 | IXYS | IGBT 300A 600V SOT-227B | Pagtatanong |
 |
IXGN200N60B | IXYS | IGBT FAST 600V 200A SOT-227B | Pagtatanong |
 |
IXGN200N60B3 | IXYS | IGBT 300A 600V SOT-227B | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers