Bumili JR28F032M29EWTB TR sa BYCHPS
Bumili na may garantiya
JR28F032M29EWTB TR
- Numero ng Bahagi:
- JR28F032M29EWTB TR
- Manufacturer:
- Micron Technology
- Paglalarawan:
- IC FLASH 32MBIT 70NS 48TSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16107 Pieces
- Data sheet:
- JR28F032M29EWTB TR.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa JR28F032M29EWTB TR, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa JR28F032M29EWTB TR sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 48-TSOP |
| bilis: | 70ns |
| serye: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 48-TFSOP (0.724", 18.40mm Width) |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Type memory: | Non-Volatile |
| Size memory: | 32Mb (4M x 8, 2M x 16) |
| memory Format: | FLASH |
| Manufacturer Bilang Bahagi: | JR28F032M29EWTB TR |
| interface: | Parallel |
| paglalarawan: | IC FLASH 32MBIT 70NS 48TSOP |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa JR28F032M29EWTB TR
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
JR28F032M29EWTA | Micron Technology Inc. | IC FLASH 32MBIT 70NS 48TSOP | Pagtatanong |
|
JR28F032M29EWLA | Micron Technology Inc. | IC FLASH 32MBIT 70NS 48TSOP | Pagtatanong |
|
JR28F032M29EWHA | Micron Technology Inc. | IC FLASH 32MBIT 70NS 48TSOP | Pagtatanong |
|
JR28F032M29EWBA | Micron Technology Inc. | IC FLASH 32MBIT 70NS 48TSOP | Pagtatanong |
|
JR28F032M29EWBB TR | Micron Technology Inc. | IC FLASH 32MBIT 70NS 48TSOP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers