Bumili K0900G sa BYCHPS
Bumili na may garantiya
K0900G
- Numero ng Bahagi:
- K0900G
- Manufacturer:
- Littelfuse
- Paglalarawan:
- SIDAC 79-97V 1A DO15
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14477 Pieces
- Data sheet:
- 1.K0900G.pdf2.K0900G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa K0900G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa K0900G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - breakover: | 79 ~ 97V |
|---|---|
| Supplier aparato Package: | DO-15 |
| serye: | - |
| packaging: | Bulk |
| Package / Kaso: | DO-204AC, DO-15, Axial |
| operating Temperature: | -40°C ~ 125°C (TJ) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 15 Weeks |
| Manufacturer Bilang Bahagi: | K0900G |
| Ang pinalawak Paglalarawan: | Diac/Sidac Thyristor 79 ~ 97V 1A DO-15 |
| paglalarawan: | SIDAC 79-97V 1A DO15 |
| Current - Peak Output: | 1A |
| Current - Hold (Ih) (Max): | 150mA |
| Current - breakover: | 10µA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa K0900G
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
K0900E70RP2 | Littelfuse Inc. | SIDAC 79-97V 1A TO92 | Pagtatanong |
 |
K0900S | Littelfuse Inc. | SIDAC 79-97V 1A DO214 | Pagtatanong |
 |
K0900GRP | Littelfuse Inc. | SIDAC 79-97V 1A DO15 | Pagtatanong |
 |
K0900E70 | Littelfuse Inc. | SIDAC 79-97V 1A TO92 | Pagtatanong |
|
K0900GURP | Littelfuse Inc. | SIDAC 79-97V 1A UNI DO-15 | Pagtatanong |
|
K0900SRP | Littelfuse Inc. | SIDAC 79-97V 1A DO214 | Pagtatanong |
 |
K0900S1URP | Littelfuse Inc. | SIDAC 79-97V 1A UNI DO-214AC | Pagtatanong |
|
K0900E70AP | Littelfuse Inc. | SIDAC 79-97V 1A TO92 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers