Bumili KMQ250VS331M22X30T2 sa BYCHPS
Bumili na may garantiya
KMQ250VS331M22X30T2
- Numero ng Bahagi:
- KMQ250VS331M22X30T2
- Manufacturer:
- Nippon Chemi-Con
- Paglalarawan:
- CAP ALUM 330UF 20% 250V SNAP
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 12794 Pieces
- Data sheet:
- KMQ250VS331M22X30T2.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa KMQ250VS331M22X30T2, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa KMQ250VS331M22X30T2 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 250V |
|---|---|
| pagpapaubaya: | ±20% |
| Ibabaw Mount Land Size: | - |
| Sukat / Dimension: | 0.866" Dia (22.00mm) |
| serye: | KMQ |
| Ripple Kasalukuyang: | 1.2A @ 120Hz |
| polariseysyon: | Polar |
| packaging: | Tray |
| Package / Kaso: | Radial, Can - Snap-In |
| operating Temperature: | -25°C ~ 105°C |
| Salalayan Type: | Through Hole |
| Manufacturer Bilang Bahagi: | KMQ250VS331M22X30T2 |
| Lifetime @ Temp.: | 2000 Hrs @ 105°C |
| Lead Spacing: | 0.394" (10.00mm) |
| impedance: | - |
| Taas - Makaupo (Max): | 1.181" (30.00mm) |
| Ang pinalawak Paglalarawan: | 330µF 250V Aluminum Capacitors Radial, Can - Snap-In 754 mOhm @ 120Hz 2000 Hrs @ 105°C |
| ESR (Katumbas Series pagtutol): | 754 mOhm @ 120Hz |
| paglalarawan: | CAP ALUM 330UF 20% 250V SNAP |
| kapasidad: | 330µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa KMQ250VS331M22X30T2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers