Bumili KUIP-14D15-12 sa BYCHPS
Bumili na may garantiya
KUIP-14D15-12
- Numero ng Bahagi:
- KUIP-14D15-12
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY GEN PURPOSE 3PDT 10A 12V
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS compliant
- Magagamit na Dami:
- 12112 Pieces
- Data sheet:
- KUIP-14D15-12.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa KUIP-14D15-12, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa KUIP-14D15-12 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 9 VDC |
|---|---|
| I-off ang Boltahe (Min): | - |
| pagwawakas Style: | Plug In, Quick Connect - 0.187" (4.7mm) |
| Paglipat Boltahe: | 240VAC - Max |
| serye: | KUIP |
| release Time: | 15ms |
| Type relay: | General Purpose |
| packaging: | Bulk |
| Ibang pangalan: | 1-1393115-6 1-1393115-6-ND 113931156 KUIP-14D15-12-ND PB1462 |
| operating Temperature: | -45°C ~ 95°C |
| Magpapatakbo Time: | 20ms |
| Salalayan Type: | Socketable |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | KUIP-14D15-12 |
| Mga tampok: | Insulation - Class B |
| Ang pinalawak Paglalarawan: | General Purpose Relay 3PDT (3 Form C) 12VDC Coil Socketable |
| paglalarawan: | RELAY GEN PURPOSE 3PDT 10A 12V |
| Contact Rating (Kasalukuyang): | 10A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | 3PDT (3 Form C) |
| Coil Boltahe: | 12VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 120 Ohms |
| Coil Power: | 1.2 W |
| Coil Kasalukuyang: | 100mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa KUIP-14D15-12
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers