Bumili LC703200AW-8C99-H sa BYCHPS
Bumili na may garantiya
LC703200AW-8C99-H
- Numero ng Bahagi:
- LC703200AW-8C99-H
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Paglalarawan:
- IC SOUND DEVICE PORTABLE 64SQFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12658 Pieces
- Data sheet:
- LC703200AW-8C99-H.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LC703200AW-8C99-H, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LC703200AW-8C99-H sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 64-SPQFP (10x10), 64-SQFP |
| Mismong: | 32 b |
| serye: | - |
| packaging: | Tray |
| Package / Kaso: | 64-LQFP |
| operating Temperature: | -30°C ~ 70°C (TA) |
| Bilang ng mga Channels: | 2 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 18 Weeks |
| Manufacturer Bilang Bahagi: | LC703200AW-8C99-H |
| interface: | I²C |
| tungkulin: | Voice Processor |
| Ang pinalawak Paglalarawan: | Audio Voice Processor 2 Channel 64-SPQFP (10x10), 64-SQFP |
| paglalarawan: | IC SOUND DEVICE PORTABLE 64SQFP |
| aplikasyon: | Audio Systems |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LC703200AW-8C99-H
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
ZL38062LDF1 | Microsemi Corporation | IC AUDIO PROC SEC CAM 56WLCSP | Pagtatanong |
 |
TDA7718BTR | STMicroelectronics | IC CAR RADIO PROC 3BAND 28TSSOP | Pagtatanong |
|
TAS5015PFBG4 | Texas Instruments | IC AUDIO PWM PROC 48TQFP | Pagtatanong |
 |
AS3543-ECTP | ams | IC CODEC AUDIO FRONT END 68CTBGA | Pagtatanong |
 |
MFA100FHI33/01E | NXP USA Inc. | IC AUDIO DEVICE 32HVQFN | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog