Bumili LC78615E-01US-H sa BYCHPS
Bumili na may garantiya
LC78615E-01US-H
- Numero ng Bahagi:
- LC78615E-01US-H
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Paglalarawan:
- IC SERVO PROC LSI CD-DSP 64QFP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12113 Pieces
- Data sheet:
- LC78615E-01US-H.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LC78615E-01US-H, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LC78615E-01US-H sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 64-PQFP (14x14) |
| Mismong: | - |
| serye: | - |
| packaging: | Tray |
| Package / Kaso: | 64-BQFP |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng mga Channels: | 1 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 4 Weeks |
| Manufacturer Bilang Bahagi: | LC78615E-01US-H |
| interface: | Serial |
| tungkulin: | Audio Signal Processor |
| Ang pinalawak Paglalarawan: | Audio Audio Signal Processor 1 Channel 64-PQFP (14x14) |
| paglalarawan: | IC SERVO PROC LSI CD-DSP 64QFP |
| aplikasyon: | Consumer Audio |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LC78615E-01US-H
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
BD3870FS-E2 | Rohm Semiconductor | IC SOUND PROCESSOR SSOP-A24 | Pagtatanong |
|
BD3872FS-E2 | Rohm Semiconductor | IC SOUND PROCESSOR SSOP-A32 | Pagtatanong |
 |
FSA8058UMX | Fairchild/ON Semiconductor | IC SW AUD DET/CONFIG SW 10UMLP | Pagtatanong |
 |
SA572NG | ON Semiconductor | IC COMPANDOR 2CHAN GAIN 16-DIP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers