Bumili LPC3250FET296,551 sa BYCHPS
Bumili na may garantiya
LPC3250FET296,551
- Numero ng Bahagi:
- LPC3250FET296,551
- Manufacturer:
- NXP Semiconductors / Freescale
- Paglalarawan:
- IC MCU 32BIT ROMLESS 296TFBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15290 Pieces
- Data sheet:
- LPC3250FET296,551.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LPC3250FET296,551, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LPC3250FET296,551 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 0.9 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 296-TFBGA (15x15) |
| bilis: | 266MHz |
| serye: | LPC3200 |
| RAM Size: | 256K x 8 |
| Type Program Memory: | ROMless |
| Size Program Memory: | - |
| Peripherals: | DMA, I²S, LCD, Motor Control PWM, PWM, WDT |
| packaging: | Tray |
| Package / Kaso: | 296-TFBGA |
| Ibang pangalan: | 568-4533 935287084551 |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 51 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | LPC3250FET296,551 |
| Ang pinalawak Paglalarawan: | ARM9® LPC3200 Microcontroller IC 16/32-Bit 266MHz ROMless 296-TFBGA (15x15) |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 32BIT ROMLESS 296TFBGA |
| data Converters: | A/D 3x10b |
| core Size: | 16/32-Bit |
| core Processor: | ARM9® |
| Connectivity: | EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LPC3250FET296,551
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog