Bumili M29DW256G70NF3E sa BYCHPS
Bumili na may garantiya
M29DW256G70NF3E
- Numero ng Bahagi:
- M29DW256G70NF3E
- Manufacturer:
- Micron Technology
- Paglalarawan:
- IC FLASH 256MBIT 70NS 56TSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19401 Pieces
- Data sheet:
- M29DW256G70NF3E.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa M29DW256G70NF3E, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa M29DW256G70NF3E sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 56-TSOP (14x20) |
| bilis: | 70ns |
| serye: | - |
| packaging: | Bulk |
| Package / Kaso: | 56-TFSOP (0.724", 18.40mm Width) |
| operating Temperature: | -40°C ~ 125°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Type memory: | Non-Volatile |
| Size memory: | 256Mb (16M x 16) |
| memory Format: | FLASH |
| Manufacturer Bilang Bahagi: | M29DW256G70NF3E |
| interface: | Parallel |
| paglalarawan: | IC FLASH 256MBIT 70NS 56TSOP |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa M29DW256G70NF3E
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
M29DW256G70ZA6F TR | Micron Technology Inc. | IC FLASH 256MBIT 70NS 64TBGA | Pagtatanong |
 |
M29DW256G70NF6F TR | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Pagtatanong |
 |
M29DW256G7ANF6F TR | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Pagtatanong |
|
M29DW256G70NF6E | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Pagtatanong |
|
M29DW256G70ZA6E | Micron Technology Inc. | IC FLASH 256MBIT 70NS 64TBGA | Pagtatanong |
|
M29DW256G7ANF6E | Micron Technology Inc. | IC FLASH 256MBIT 70NS 56TSOP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog