Bumili M5475AFE sa BYCHPS
Bumili na may garantiya
M5475AFE
- Numero ng Bahagi:
- M5475AFE
- Manufacturer:
- NXP Semiconductors / Freescale
- Paglalarawan:
- MODULE FIRE ENGINE
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 16587 Pieces
- Data sheet:
- M5475AFE.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa M5475AFE, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa M5475AFE sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| bilis: | 266MHz |
|---|---|
| Sukat / Dimension: | 3.7" x 4.5" (93.4mm x 114.3mm) |
| serye: | ColdFire® |
| RAM Size: | 64MB |
| operating Temperature: | 0°C ~ 70°C |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Module / Uri Board: | MPU Core |
| Manufacturer Bilang Bahagi: | M5475AFE |
| Flash Size: | 2MB (Boot) |
| Ang pinalawak Paglalarawan: | ColdFire® Embedded Module ColdFire V4e, MCF5475 266MHz 64MB 2MB (Boot) |
| paglalarawan: | MODULE FIRE ENGINE |
| core Processor: | ColdFire V4e, MCF5475 |
| Type connector: | - |
| Co-Processor: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa M5475AFE
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
FS-3008 | Digi International | MODULE 32MB SDRAM 32MB FLASH | Pagtatanong |
 |
M5475BFE | NXP USA Inc. | MODULE FIRE ENGINE | Pagtatanong |
|
CC-9P-V225-Z1 | Digi International | CONNECTCORE | Pagtatanong |
 |
SOMXC6748-10-1602AHCR | Logic | SYSTEM ON MODULE LV TMS320C6748 | Pagtatanong |
|
M5475DFE | NXP USA Inc. | MODULE FIRE ENGINE | Pagtatanong |
|
M5475EFE | NXP USA Inc. | MODULE FIRE ENGINE | Pagtatanong |
|
M5475CFE | NXP USA Inc. | MODULE FIRE ENGINE | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog