Bumili MAVR-011020-14110P sa BYCHPS
Bumili na may garantiya
MAVR-011020-14110P
- Numero ng Bahagi:
- MAVR-011020-14110P
- Manufacturer:
- Aeroflex (MACOM Technology Solutions)
- Paglalarawan:
- SOLDERABLE GAAS CONSTANT GAMMA F
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13812 Pieces
- Data sheet:
- MAVR-011020-14110P.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MAVR-011020-14110P, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MAVR-011020-14110P sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Peak Reverse (Max): | 22V |
|---|---|
| Supplier aparato Package: | 2-FlipChip |
| serye: | - |
| Q @ Vr, F: | 3000 @ 4V, 50MHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 2-XFDFN, FCDFN |
| Ibang pangalan: | 1465-1782-2 |
| operating Temperature: | -40°C ~ 125°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | MAVR-011020-14110P |
| Ang pinalawak Paglalarawan: | Varactor Single 22V Surface Mount 2-FlipChip |
| Type diode: | Single |
| paglalarawan: | SOLDERABLE GAAS CONSTANT GAMMA F |
| Kapasidad Ratio Kondisyon: | - |
| kapasidad Ratio: | - |
| Kapasidad @ Vr, F: | 0.05pF @ 15V, 1MHz |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MAVR-011020-14110P
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
MAVR-011020-14110G | M/A-Com Technology Solutions | SOLDERABLE GAAS CONSTANT GAMMA F | Pagtatanong |
 |
MAVR-000120-14110G | M/A-Com Technology Solutions | DIODE VARACTOR | Pagtatanong |
 |
SMV2023-001LF | Skyworks Solutions Inc. | DIODE VARACTOR 22V 100MA SOT-23 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers