Bumili MAX5592EUG+ sa BYCHPS
Bumili na may garantiya
MAX5592EUG+
- Numero ng Bahagi:
- MAX5592EUG+
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC DAC 10BIT OCTAL BUFF 24-TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17536 Pieces
- Data sheet:
- 1.MAX5592EUG+.pdf2.MAX5592EUG+.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MAX5592EUG+, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MAX5592EUG+ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Digital: | 1.8 V ~ 5.25 V |
|---|---|
| Boltahe - Supply, Analog: | 2.7 V ~ 5.25 V |
| Supplier aparato Package: | 24-TSSOP |
| Pag-aayos Time: | 6µs |
| serye: | - |
| Type reference: | External |
| packaging: | Tube |
| Package / Kaso: | 24-TSSOP (0.173", 4.40mm Width) |
| Type output: | Voltage - Buffered |
| operating Temperature: | -40°C ~ 85°C |
| Bilang ng D / A converter: | 8 |
| Bilang ng mga Bits: | 10 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | MAX5592EUG+ |
| INL / DNL (LSB): | ±0.5, ±1 (Max) |
| Ang pinalawak Paglalarawan: | 10 Bit Digital to Analog Converter 8 24-TSSOP |
| Differential Output: | No |
| paglalarawan: | IC DAC 10BIT OCTAL BUFF 24-TSSOP |
| data Interface: | SPI, DSP |
| arkitektura: | R-2R |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MAX5592EUG+
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers