Bumili MGV06033R3M-10 sa BYCHPS
Bumili na may garantiya
MGV06033R3M-10
- Numero ng Bahagi:
- MGV06033R3M-10
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Paglalarawan:
- FIXED IND 3.3UH 6A 30 MOHM SMD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14203 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MGV06033R3M-10, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MGV06033R3M-10 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Wirewound |
|---|---|
| pagpapaubaya: | ±20% |
| Supplier aparato Package: | - |
| Sukat / Dimension: | 0.287" L x 0.264" W (7.30mm x 6.70mm) |
| shielding: | Shielded |
| serye: | MGV |
| Ratings: | - |
| Q @ Freq: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | Nonstandard |
| Ibang pangalan: | 240-2902-2 MGV06033R3M-10-ND |
| operating Temperature: | -40°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | - |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | MGV06033R3M-10 |
| inductance: | 3.3µH |
| Taas - Makaupo (Max): | 0.130" (3.30mm) |
| Frequency - Test: | 100kHz |
| Frequency - Self Resonant: | - |
| Ang pinalawak Paglalarawan: | 3.3µH Shielded Wirewound Inductor 6A 30 mOhm Max Nonstandard |
| paglalarawan: | FIXED IND 3.3UH 6A 30 MOHM SMD |
| DC pagtutol (DCR): | 30 mOhm Max |
| kasalukuyang Rating: | 6A |
| Current - Saturation: | 13.5A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MGV06033R3M-10
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers