Bumili MKP1V240G sa BYCHPS
Bumili na may garantiya
MKP1V240G
- Numero ng Bahagi:
- MKP1V240G
- Manufacturer:
- Littelfuse
- Paglalarawan:
- SIDAC 220-250V 900MA AXIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14678 Pieces
- Data sheet:
- 1.MKP1V240G.pdf2.MKP1V240G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MKP1V240G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MKP1V240G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - breakover: | 220 ~ 250V |
|---|---|
| Supplier aparato Package: | Axial |
| serye: | - |
| packaging: | Bulk |
| Package / Kaso: | DO-204AL, DO-41, Axial |
| operating Temperature: | -40°C ~ 125°C (TJ) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | MKP1V240G |
| Ang pinalawak Paglalarawan: | Diac/Sidac Thyristor 220 ~ 250V 900mA Axial |
| paglalarawan: | SIDAC 220-250V 900MA AXIAL |
| Current - Peak Output: | 900mA |
| Current - Hold (Ih) (Max): | 100mA |
| Current - breakover: | 35µA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MKP1V240G
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
MKP1V160G | Littelfuse Inc. | SIDAC 150-170V 900MA AXIAL | Pagtatanong |
|
MKP1V240RLG | Littelfuse Inc. | SIDAC 220-250V 900MA AXIAL | Pagtatanong |
|
MKP1V160RLG | Littelfuse Inc. | SIDAC 150-170V 900MA AXIAL | Pagtatanong |
 |
HT60RP | Littelfuse Inc. | DIAC 56-70V 1.5A DO35 | Pagtatanong |
|
MKP1V120RLG | Littelfuse Inc. | SIDAC 110-130V 900MA AXIAL | Pagtatanong |
|
MKP1V130RLG | Littelfuse Inc. | SIDAC 120-140V 900MA AXIAL | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers