Bumili ML620Q133NGDZWANL sa BYCHPS
Bumili na may garantiya
ML620Q133NGDZWANL
- Numero ng Bahagi:
- ML620Q133NGDZWANL
- Manufacturer:
- LAPIS Semiconductor
- Paglalarawan:
- IC MCU 16BIT 24KB FLASH 16WQFN
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17767 Pieces
- Data sheet:
- ML620Q133NGDZWANL.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa ML620Q133NGDZWANL, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa ML620Q133NGDZWANL sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 1.6 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 16-WQFN (4x4) |
| bilis: | 16MHz |
| serye: | ML620100 |
| RAM Size: | 2K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 24KB (12K x 16) |
| Peripherals: | POR, PWM, WDT |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 16-WFQFN Exposed Pad |
| Ibang pangalan: | ML620Q133-NNNGDZ0ANL ML620Q133-NNNGDZ0ANLTR ML620Q133-NNNGDZ0ANLTR-ND ML620Q133-NNNGDZWANL ML620Q133-TR-ND ML620Q133NGDZWANL-ND ML620Q133NGDZWANLTR ML620Q133NNNGDZ0A-ND |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 105°C (TA) |
| Bilang ng I / O: | 10 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | ML620Q133NGDZWANL |
| Ang pinalawak Paglalarawan: | nX-U16/100 ML620100 Microcontroller IC 16-Bit 16MHz 24KB (12K x 16) FLASH 16-WQFN (4x4) |
| EEPROM Size: | 1K x 16 |
| paglalarawan: | IC MCU 16BIT 24KB FLASH 16WQFN |
| data Converters: | A/D 6x10b |
| core Size: | 16-Bit |
| core Processor: | nX-U16/100 |
| Connectivity: | I²C, SPI, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa ML620Q133NGDZWANL
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers