Bumili MS1337 sa BYCHPS
Bumili na may garantiya
MS1337
- Numero ng Bahagi:
- MS1337
- Manufacturer:
- Microsemi
- Paglalarawan:
- TRANS RF BIPO 70W 8A M113
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16774 Pieces
- Data sheet:
- MS1337.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MS1337, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MS1337 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 18V |
|---|---|
| Type transistor: | NPN |
| Supplier aparato Package: | M113 |
| serye: | - |
| Power - Max: | 70W |
| packaging: | Bulk |
| Package / Kaso: | M113 |
| operating Temperature: | 200°C (TJ) |
| Noise Figure (DB Typ @ f): | - |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | MS1337 |
| pakinabang: | 10dB |
| Frequency - Transition: | 175MHz |
| Ang pinalawak Paglalarawan: | RF Transistor NPN 18V 8A 175MHz 70W Chassis Mount M113 |
| paglalarawan: | TRANS RF BIPO 70W 8A M113 |
| DC Kasalukuyang Gain (HFE) (Min) @ Ic, Vce: | 20 @ 250mA, 5V |
| Current - kolektor (Ic) (Max): | 8A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MS1337
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
UTV080 | Microsemi Corporation | TRANS RF BIPO 65W 2.5A 55JV2 | Pagtatanong |
 |
ZUMTS17NTA | Diodes Incorporated | TRANS RF 3.2GHZ 11V SOT323 | Pagtatanong |
 |
BFG198,115 | NXP USA Inc. | TRANS NPN 10V 8GHZ SC73 | Pagtatanong |
 |
MPSH17 | Fairchild/ON Semiconductor | TRANS NPN 15V TO-92 | Pagtatanong |
|
MS1336 | Microsemi Corporation | TRANS RF BIPO 70W 8A M135 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers