Bumili NLV32T-3R9J-EFD sa BYCHPS
Bumili na may garantiya
NLV32T-3R9J-EFD
- Numero ng Bahagi:
- NLV32T-3R9J-EFD
- Manufacturer:
- TDK Corporation
- Paglalarawan:
- FIXED IND 3.9UH 250MA 1.3 OHM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14200 Pieces
- Data sheet:
- NLV32T-3R9J-EFD.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa NLV32T-3R9J-EFD, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa NLV32T-3R9J-EFD sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Wirewound |
|---|---|
| pagpapaubaya: | ±5% |
| Supplier aparato Package: | 1210 |
| Sukat / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| shielding: | Unshielded |
| serye: | NLV-EFD |
| Ratings: | AEC-Q200 |
| Q @ Freq: | 30 @ 7.96MHz |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1210 (3225 Metric) |
| Ibang pangalan: | 445-16595-2 NLV32T-3R9J-EFD-ND |
| operating Temperature: | -40°C ~ 105°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | NLV32T-3R9J-EFD |
| inductance: | 3.9µH |
| Taas - Makaupo (Max): | 0.094" (2.40mm) |
| Frequency - Test: | 7.96MHz |
| Frequency - Self Resonant: | 55MHz |
| Ang pinalawak Paglalarawan: | 3.9µH Unshielded Wirewound Inductor 250mA 1.3 Ohm Max 1210 (3225 Metric) |
| paglalarawan: | FIXED IND 3.9UH 250MA 1.3 OHM |
| DC pagtutol (DCR): | 1.3 Ohm Max |
| kasalukuyang Rating: | 250mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa NLV32T-3R9J-EFD
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers