Bumili NVD3055L170T4G-VF01 sa BYCHPS
Bumili na may garantiya
NVD3055L170T4G-VF01
- Numero ng Bahagi:
- NVD3055L170T4G-VF01
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Paglalarawan:
- MOSFET N-CH 60V 9A DPAK
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13652 Pieces
- Data sheet:
- NVD3055L170T4G-VF01.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa NVD3055L170T4G-VF01, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa NVD3055L170T4G-VF01 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 2V @ 250µA |
|---|---|
| Vgs (Max): | ±15V |
| teknolohiya: | MOSFET (Metal Oxide) |
| Supplier aparato Package: | DPAK |
| serye: | - |
| Rds On (Max) @ Id, Vgs: | 170 mOhm @ 4.5A, 5V |
| Power pagwawaldas (Max): | 1.5W (Ta), 28.5W (Tj) |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Ibang pangalan: | NVD3055L170T4G NVD3055L170T4G-ND NVD3055L170T4G-VF01TR NVD3055L170T4GOSTR-ND |
| operating Temperature: | -55°C ~ 175°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | NVD3055L170T4G-VF01 |
| Input Kapasidad (Ciss) (Max) @ Vds: | 275pF @ 25V |
| Gate Charge (Qg) (Max) @ Vgs: | 10nC @ 5V |
| Type FET: | N-Channel |
| FET Tampok: | - |
| Ang pinalawak Paglalarawan: | N-Channel 60V 9A (Ta) 1.5W (Ta), 28.5W (Tj) Surface Mount DPAK |
| Drive Boltahe (Max Rds On, Min Rds On): | 5V |
| Alisan ng tubig sa Source Boltahe (Vdss): | 60V |
| paglalarawan: | MOSFET N-CH 60V 9A DPAK |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 9A (Ta) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa NVD3055L170T4G-VF01
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers