Bumili OJ-SH-105LM,000 sa BYCHPS
Bumili na may garantiya
OJ-SH-105LM,000
- Numero ng Bahagi:
- OJ-SH-105LM,000
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY GENERAL PURPOSE SPST 3A 5V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16251 Pieces
- Data sheet:
- OJ-SH-105LM,000.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa OJ-SH-105LM,000, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa OJ-SH-105LM,000 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 3.75 VDC |
|---|---|
| I-off ang Boltahe (Min): | 0.25 VDC |
| pagwawakas Style: | PC Pin |
| Paglipat Boltahe: | 277VAC, 30VDC - Max |
| serye: | OJ, OEG |
| release Time: | 4ms |
| Type relay: | General Purpose |
| packaging: | Bulk |
| Ibang pangalan: | 1461404-1 1461404-1-ND PB2046 |
| operating Temperature: | -30°C ~ 90°C |
| Magpapatakbo Time: | 15ms |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 18 Weeks |
| Manufacturer Bilang Bahagi: | OJ-SH-105LM,000 |
| Mga tampok: | Sealed - Fully |
| Ang pinalawak Paglalarawan: | General Purpose Relay SPST-NO (1 Form A) 5VDC Coil Through Hole |
| paglalarawan: | RELAY GENERAL PURPOSE SPST 3A 5V |
| Contact Rating (Kasalukuyang): | 3A |
| Contact Material: | Silver (Ag) |
| Contact Form: | SPST-NO (1 Form A) |
| Coil Boltahe: | 5VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 125 Ohms |
| Coil Power: | 200 mW |
| Coil Kasalukuyang: | 40mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa OJ-SH-105LM,000
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers