Bumili P6D-04P sa BYCHPS
Bumili na may garantiya
P6D-04P
- Numero ng Bahagi:
- P6D-04P
- Manufacturer:
- Omron
- Paglalarawan:
- RELAY SOCKET PC MNT FOR G6D-ASI
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19109 Pieces
- Data sheet:
- P6D-04P.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa P6D-04P, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa P6D-04P sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Socket |
|---|---|
| pagwawakas Style: | PC Pin |
| serye: | G6D-ASI |
| Ibang pangalan: | P6D-04P-ND P6D04P SW802 SW802-ND Z1684 |
| Bilang ng Posisyon: | 4 |
| Salalayan Type: | Through Hole |
| Tagagawa Standard Lead Time: | 2 Weeks |
| Manufacturer Bilang Bahagi: | P6D-04P |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | G6D-ASI Series |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | Relay Socket Through Hole |
| paglalarawan: | RELAY SOCKET PC MNT FOR G6D-ASI |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa P6D-04P
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
2912484 | Phoenix Contact | 14 MM PLC BASIC TERM BLOCK | Pagtatanong |
 |
3-1904045-3 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A010-EV-311 | Pagtatanong |
|
1904045-1 | TE Connectivity Potter & Brumfield Relays | V23333Z0001A007-EV-000 | Pagtatanong |
 |
P6DS-04P | Omron Electronics Inc-EMC Div | CONNECTING SOCKET FOR G6DS | Pagtatanong |
 |
2-1904045-4 | TE Connectivity Potter & Brumfield Relays | V23333Z0002A041-EV-100 | Pagtatanong |
 |
27E489 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY PC MNT FOR K10 SER | Pagtatanong |
 |
1-1904045-2 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET HOUSING ISO | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers