Bumili P6SMB7.5CA-M3/5B sa BYCHPS
Bumili na may garantiya
P6SMB7.5CA-M3/5B
- Numero ng Bahagi:
- P6SMB7.5CA-M3/5B
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- TVS DIODE 6.4VWM 11.3VC DO-214AA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12844 Pieces
- Data sheet:
- 1.P6SMB7.5CA-M3/5B.pdf2.P6SMB7.5CA-M3/5B.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa P6SMB7.5CA-M3/5B, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa P6SMB7.5CA-M3/5B sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Baliktarin Standoff (Typ): | 6.4V |
|---|---|
| Boltahe - Clamping (Max) @ IPP: | 11.3V |
| Boltahe - Breakdown (Min): | 7.13V |
| uri: | Zener |
| Supplier aparato Package: | DO-214AA (SMBJ) |
| serye: | P6SMB, TransZorb® |
| Power Line Protection: | No |
| Power - Peak Pulse: | 600W |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | DO-214AA, SMB |
| operating Temperature: | -65°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 36 Weeks |
| Manufacturer Bilang Bahagi: | P6SMB7.5CA-M3/5B |
| paglalarawan: | TVS DIODE 6.4VWM 11.3VC DO-214AA |
| Current - Peak Pulse (10 / 1000μs): | 53.1A |
| Kapasidad @ Frequency: | - |
| bidirectional Channels: | 1 |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa P6SMB7.5CA-M3/5B
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers