Bumili PCN-105D3MHZ,000 sa BYCHPS
Bumili na may garantiya
PCN-105D3MHZ,000
- Numero ng Bahagi:
- PCN-105D3MHZ,000
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY GENERAL PURPOSE SPST 3A 5V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17559 Pieces
- Data sheet:
- PCN-105D3MHZ,000.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa PCN-105D3MHZ,000, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa PCN-105D3MHZ,000 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 3.5 VDC |
|---|---|
| I-off ang Boltahe (Min): | 0.5 VDC |
| pagwawakas Style: | PC Pin |
| Paglipat Boltahe: | 277VAC, 125VDC - Max |
| serye: | PCN, SCHRACK |
| release Time: | 3ms |
| Type relay: | General Purpose |
| packaging: | Tube |
| Ibang pangalan: | 3-1461491-0 PCN-105D3MHZ 000 PCN-105D3MHZ,000-ND PCN105D3MHZ,000 PCN105D3MHZ000 |
| operating Temperature: | -30°C ~ 70°C |
| Magpapatakbo Time: | 8ms |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | PCN-105D3MHZ,000 |
| Mga tampok: | Sealed - Fully |
| Ang pinalawak Paglalarawan: | General Purpose Relay SPST-NO (1 Form A) 5VDC Coil Through Hole |
| paglalarawan: | RELAY GENERAL PURPOSE SPST 3A 5V |
| Contact Rating (Kasalukuyang): | 3A |
| Contact Material: | Silver Nickel (AgNi) |
| Contact Form: | SPST-NO (1 Form A) |
| Coil Boltahe: | 5VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 208 Ohms |
| Coil Power: | 120 mW |
| Coil Kasalukuyang: | 24mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa PCN-105D3MHZ,000
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers