Bumili PI74SSTU32866NBE sa BYCHPS
Bumili na may garantiya
PI74SSTU32866NBE
- Numero ng Bahagi:
- PI74SSTU32866NBE
- Manufacturer:
- Diodes Incorporated
- Paglalarawan:
- IC 25BIT CONFIG REG BUFF 96LFBGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16033 Pieces
- Data sheet:
- PI74SSTU32866NBE.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa PI74SSTU32866NBE, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa PI74SSTU32866NBE sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Supply Boltahe: | 1.7 V ~ 1.9 V |
|---|---|
| Supplier aparato Package: | 96-LFBGA (13.5x5.5) |
| serye: | - |
| packaging: | Tray |
| Package / Kaso: | 96-LFBGA |
| operating Temperature: | 0°C ~ 70°C |
| Bilang ng mga Bits: | 25, 14 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | PI74SSTU32866NBE |
| logic Type: | 1:1, 1:2 Configurable Registered Buffer with Parity |
| Ang pinalawak Paglalarawan: | 1:1, 1:2 Configurable Registered Buffer with Parity IC 96-LFBGA (13.5x5.5) |
| paglalarawan: | IC 25BIT CONFIG REG BUFF 96LFBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa PI74SSTU32866NBE
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
PI74SSTU32864ANBE | Diodes Incorporated | IC 25BIT CONFIG REG BUFF 96LFBGA | Pagtatanong |
|
PI74SSTU32864NBE | Diodes Incorporated | IC 25BIT CONFIG REG BUFF 96LFBGA | Pagtatanong |
 |
SN74BCT8374ANT | Texas Instruments | IC SCAN TEST DEVICE W/FF 24-DIP | Pagtatanong |
 |
SY10EL16VEZG-TR | Microchip Technology | IC RCVR DIFF 3.3/5V 8-SOIC | Pagtatanong |
 |
SSTUH32866EC/G,551 | NXP USA Inc. | IC BUFFER 1.8V 25BIT SOT536-1 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers