Bumili PIC24FV16KA302T-I/ML sa BYCHPS
Bumili na may garantiya
PIC24FV16KA302T-I/ML
- Numero ng Bahagi:
- PIC24FV16KA302T-I/ML
- Manufacturer:
- Micrel / Microchip Technology
- Paglalarawan:
- IC MCU 16BIT 16KB FLASH 28QFN
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19205 Pieces
- Data sheet:
- PIC24FV16KA302T-I/ML.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa PIC24FV16KA302T-I/ML, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa PIC24FV16KA302T-I/ML sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 2 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 28-QFN (6x6) |
| bilis: | 32MHz |
| serye: | PIC® XLP™ 24F |
| RAM Size: | 2K x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 16KB (5.5K x 24) |
| Peripherals: | Brown-out Detect/Reset, HLVD, POR, PWM, WDT |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 28-VQFN Exposed Pad |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng I / O: | 23 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 5 Weeks |
| Manufacturer Bilang Bahagi: | PIC24FV16KA302T-I/ML |
| Ang pinalawak Paglalarawan: | PIC PIC® XLP™ 24F Microcontroller IC 16-Bit 32MHz 16KB (5.5K x 24) FLASH 28-QFN (6x6) |
| EEPROM Size: | 512 x 8 |
| paglalarawan: | IC MCU 16BIT 16KB FLASH 28QFN |
| data Converters: | A/D 13x12b |
| core Size: | 16-Bit |
| core Processor: | PIC |
| Connectivity: | I²C, IrDA, LIN, SPI, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa PIC24FV16KA302T-I/ML
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers