Bumili RACF164DJT22K0 sa BYCHPS
Bumili na may garantiya
RACF164DJT22K0
- Numero ng Bahagi:
- RACF164DJT22K0
- Manufacturer:
- Stackpole Electronics, Inc.
- Paglalarawan:
- RES ARRAY 4 RES 22K OHM 1206
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19790 Pieces
- Data sheet:
- 1.RACF164DJT22K0.pdf2.RACF164DJT22K0.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RACF164DJT22K0, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RACF164DJT22K0 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| pagpapaubaya: | ±5% |
|---|---|
| temperatura koepisyent: | ±200ppm/°C |
| Supplier aparato Package: | - |
| Sukat / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| serye: | RACF |
| Resistance (Ohms): | 22k |
| Power Per Element: | 62.5mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1206 (3216 Metric), Concave, Long Side Terminals |
| Ibang pangalan: | RAC 164D 22K 5% R RAC164D22K5%R RAC164D22K5%R-ND RAC164D22KJR RAC164D22KJR-ND |
| operating Temperature: | -55°C ~ 155°C |
| Bilang ng Resistors: | 4 |
| Bilang ng mga Pins: | 8 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 11 Weeks |
| Manufacturer Bilang Bahagi: | RACF164DJT22K0 |
| Taas - Makaupo (Max): | 0.030" (0.75mm) |
| Ang pinalawak Paglalarawan: | 22k Ohm ±5% 62.5mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 1206 (3216 Metric), Concave, Long Side Terminals |
| paglalarawan: | RES ARRAY 4 RES 22K OHM 1206 |
| circuit Type: | Isolated |
| aplikasyon: | Automotive AEC-Q200 |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RACF164DJT22K0
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers