Bumili RAVF164DJT560R sa BYCHPS
Bumili na may garantiya
RAVF164DJT560R
- Numero ng Bahagi:
- RAVF164DJT560R
- Manufacturer:
- Stackpole Electronics, Inc.
- Paglalarawan:
- RES ARRAY 4 RES 560 OHM 1206
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13117 Pieces
- Data sheet:
- 1.RAVF164DJT560R.pdf2.RAVF164DJT560R.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RAVF164DJT560R, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RAVF164DJT560R sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| pagpapaubaya: | ±5% |
|---|---|
| temperatura koepisyent: | ±200ppm/°C |
| Supplier aparato Package: | - |
| Sukat / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| serye: | RAVF |
| Resistance (Ohms): | 560 |
| Power Per Element: | 62.5mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1206 (3216 Metric), Convex, Long Side Terminals |
| Ibang pangalan: | RAV 164D 560 5% R RAV164D5605%R RAV164D5605%R-ND RAV164D560JR RAV164D560JR-ND |
| operating Temperature: | -55°C ~ 155°C |
| Bilang ng Resistors: | 4 |
| Bilang ng mga Pins: | 8 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 11 Weeks |
| Manufacturer Bilang Bahagi: | RAVF164DJT560R |
| Taas - Makaupo (Max): | 0.024" (0.60mm) |
| Ang pinalawak Paglalarawan: | 560 Ohm ±5% 62.5mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 1206 (3216 Metric), Convex, Long Side Terminals |
| paglalarawan: | RES ARRAY 4 RES 560 OHM 1206 |
| circuit Type: | Isolated |
| aplikasyon: | Automotive AEC-Q200 |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RAVF164DJT560R
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers