Bumili RJH60F3DPQ-A0#T0 sa BYCHPS
Bumili na may garantiya
RJH60F3DPQ-A0#T0
- Numero ng Bahagi:
- RJH60F3DPQ-A0#T0
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IGBT 600V 40A 178.5W TO-247A
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14421 Pieces
- Data sheet:
- RJH60F3DPQ-A0#T0.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RJH60F3DPQ-A0#T0, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RJH60F3DPQ-A0#T0 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 1.82V @ 15V, 20A |
| Test Kundisyon: | 400V, 30A, 5 Ohm, 15V |
| Td (on / off) @ 25 ° C: | 44ns/65ns |
| Ang paglipat Energy: | - |
| Supplier aparato Package: | TO-247A |
| serye: | - |
| Reverse Recovery Time (trr): | 90ns |
| Power - Max: | 178.5W |
| packaging: | Tube |
| Package / Kaso: | TO-247-3 |
| Ibang pangalan: | RJH60F3DPQA0T0 |
| operating Temperature: | 150°C (TJ) |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | RJH60F3DPQ-A0#T0 |
| Type input: | Standard |
| Type IGBT: | Trench |
| Ang pinalawak Paglalarawan: | IGBT Trench 600V 40A 178.5W Through Hole TO-247A |
| paglalarawan: | IGBT 600V 40A 178.5W TO-247A |
| Current - Kolektor Pulsed (Icm): | - |
| Current - kolektor (Ic) (Max): | 40A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RJH60F3DPQ-A0#T0
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers