Bumili RJH65D27BDPQ-A0#T2 sa BYCHPS
Bumili na may garantiya
RJH65D27BDPQ-A0#T2
- Numero ng Bahagi:
- RJH65D27BDPQ-A0#T2
- Manufacturer:
- Renesas Electronics America
- Paglalarawan:
- IGBT - 650V/50A/TO-247A
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12631 Pieces
- Data sheet:
- RJH65D27BDPQ-A0#T2.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RJH65D27BDPQ-A0#T2, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RJH65D27BDPQ-A0#T2 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 650V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 1.65V @ 15V, 50A |
| Test Kundisyon: | 400V, 50A, 10 Ohm, 15V |
| Td (on / off) @ 25 ° C: | 20ns/165ns |
| Ang paglipat Energy: | 1mJ (on), 1.5mJ (off) |
| Supplier aparato Package: | TO-247A |
| serye: | - |
| Reverse Recovery Time (trr): | 80ns |
| Power - Max: | 375W |
| packaging: | Tube |
| Package / Kaso: | TO-247-3 |
| operating Temperature: | 175°C (TJ) |
| Salalayan Type: | Through Hole |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | RJH65D27BDPQ-A0#T2 |
| Type input: | Standard |
| Type IGBT: | Trench |
| gate charge: | 175nC |
| Ang pinalawak Paglalarawan: | IGBT Trench 650V 100A 375W Through Hole TO-247A |
| paglalarawan: | IGBT - 650V/50A/TO-247A |
| Current - Kolektor Pulsed (Icm): | - |
| Current - kolektor (Ic) (Max): | 100A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RJH65D27BDPQ-A0#T2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers