Bumili RM25C256C-LSNI-T sa BYCHPS
Bumili na may garantiya
RM25C256C-LSNI-T
- Numero ng Bahagi:
- RM25C256C-LSNI-T
- Manufacturer:
- Adesto Technologies
- Paglalarawan:
- IC EEPROM 256KBIT 10MHZ 8SOIC
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16644 Pieces
- Data sheet:
- RM25C256C-LSNI-T.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RM25C256C-LSNI-T, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RM25C256C-LSNI-T sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.65 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 8-SOIC |
| bilis: | 10MHz |
| serye: | Mavriq™ |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 8-SOIC (0.154", 3.90mm Width) |
| Ibang pangalan: | 1265-1212-2 |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Type memory: | Non-Volatile |
| Size memory: | 256kb (64B Page Size) |
| memory Format: | EEPROM |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | RM25C256C-LSNI-T |
| interface: | SPI Serial |
| paglalarawan: | IC EEPROM 256KBIT 10MHZ 8SOIC |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RM25C256C-LSNI-T
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
RM25C256C-LSNI-B | Adesto Technologies | IC EEPROM 256KBIT 10MHZ 8SOIC | Pagtatanong |
|
RM25C256DS-LTAI-B | Adesto Technologies | IC EEPROM 256KBIT 10MHZ 8TSSOP | Pagtatanong |
 |
RM25C256C-LMAI-T | Adesto Technologies | IC EEPROM 256KBIT 10MHZ 8DFN | Pagtatanong |
|
RM25C256C-LTAI-B | Adesto Technologies | IC EEPROM 256KBIT 10MHZ 8TSSOP | Pagtatanong |
|
RM25C256C-LTAI-T | Adesto Technologies | IC EEPROM 256KBIT 10MHZ 8TSSOP | Pagtatanong |
|
RM25C256DS-LSNI-B | Adesto Technologies | IC EEPROM 256KBIT 10MHZ 8SOIC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers