Bumili RM707060 sa BYCHPS
Bumili na may garantiya
RM707060
- Numero ng Bahagi:
- RM707060
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY GEN PURPOSE 3PDT 16A 60V
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS compliant
- Magagamit na Dami:
- 12663 Pieces
- Data sheet:
- RM707060.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RM707060, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RM707060 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 45 VDC |
|---|---|
| I-off ang Boltahe (Min): | 6 VDC |
| pagwawakas Style: | PC Pin |
| Paglipat Boltahe: | 440VAC - Max |
| serye: | RM, SCHRACK |
| release Time: | 10ms |
| Type relay: | General Purpose |
| packaging: | Tray |
| Ibang pangalan: | 1-1393149-9 |
| operating Temperature: | -45°C ~ 60°C |
| Magpapatakbo Time: | 15ms |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 29 Weeks |
| Manufacturer Bilang Bahagi: | RM707060 |
| Mga tampok: | Mechanical Indicator |
| Ang pinalawak Paglalarawan: | General Purpose Relay 3PDT (3 Form C) 60VDC Coil Through Hole |
| paglalarawan: | RELAY GEN PURPOSE 3PDT 16A 60V |
| Contact Rating (Kasalukuyang): | 16A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | 3PDT (3 Form C) |
| Coil Boltahe: | 60VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 2.2 kOhms |
| Coil Power: | 1.6 W |
| Coil Kasalukuyang: | 26.7mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RM707060
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers