Bumili RMCF0603FT3K09 sa BYCHPS
Bumili na may garantiya
RMCF0603FT3K09
- Numero ng Bahagi:
- RMCF0603FT3K09
- Manufacturer:
- Stackpole Electronics, Inc.
- Paglalarawan:
- RES SMD 3.09K OHM 1% 1/10W 0603
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15699 Pieces
- Data sheet:
- 1.RMCF0603FT3K09.pdf2.RMCF0603FT3K09.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RMCF0603FT3K09, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RMCF0603FT3K09 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| pagpapaubaya: | ±1% |
|---|---|
| temperatura koepisyent: | ±100ppm/°C |
| Supplier aparato Package: | 0603 |
| Sukat / Dimension: | 0.061" L x 0.031" W (1.55mm x 0.80mm) |
| serye: | RMCF |
| Resistance (Ohms): | 3.09k |
| Power (Watts): | 0.1W, 1/10W |
| packaging: | Original-Reel® |
| Package / Kaso: | 0603 (1608 Metric) |
| Ibang pangalan: | RMCF0603FT3K09DKR RMCF1/163.09K1%RDKR RMCF1/163.09K1%RDKR-ND RMCF1/163.09KFRDKR RMCF1/163.09KFRDKR-ND |
| operating Temperature: | -55°C ~ 155°C |
| Bilang ng mga Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | RMCF0603FT3K09 |
| Taas - Makaupo (Max): | 0.022" (0.55mm) |
| Mga tampok: | Automotive AEC-Q200 |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 3.09k Ohm ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Automotive AEC-Q200 Thick Film |
| paglalarawan: | RES SMD 3.09K OHM 1% 1/10W 0603 |
| komposisyon: | Thick Film |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RMCF0603FT3K09
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog