Bumili S01PM5805K016A sa BYCHPS
Bumili na may garantiya
S01PM5805K016A
- Numero ng Bahagi:
- S01PM5805K016A
- Manufacturer:
- KEMET
- Paglalarawan:
- CAP 58F 10% 16V CHASSIS MOUNT
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13374 Pieces
- Data sheet:
- S01PM5805K016A.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa S01PM5805K016A, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa S01PM5805K016A sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 16V |
|---|---|
| pagpapaubaya: | ±10% |
| pagwawakas: | Screw Terminals |
| Sukat / Dimension: | 8.873" L x 2.000" W (225.37mm x 50.80mm) |
| serye: | S01 |
| packaging: | Bulk |
| Package / Kaso: | Module |
| Ibang pangalan: | 399-11550 |
| operating Temperature: | -40°C ~ 65°C |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | S01PM5805K016A |
| Lifetime @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | 3.000" (76.20mm) |
| Ang pinalawak Paglalarawan: | 58F ±10%(EDLC) Supercapacitor 16V Module 23 mOhm 1000 Hrs @ 65°C |
| ESR (Katumbas Series pagtutol): | 23 mOhm |
| paglalarawan: | CAP 58F 10% 16V CHASSIS MOUNT |
| kapasidad: | 58F |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa S01PM5805K016A
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
PB-5R0H104-R | Eaton | CAP 100MF -20% +80% 5V T/H | Pagtatanong |
 |
MAL219691122E3 | Vishay BC Components | CAP ALUM 4F 2.8V SNAP | Pagtatanong |
 |
SCMR18C105MSBA0 | AVX Corporation | CAPACITOR 1F 20% 5V THRU HOLE | Pagtatanong |
 |
KR-5R5C474-R | Eaton | CAP 470MF -20% +80% 5.5V T/H | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers