Bumili S27KL0641DABHA020 sa BYCHPS
Bumili na may garantiya
S27KL0641DABHA020
- Numero ng Bahagi:
- S27KL0641DABHA020
- Manufacturer:
- Cypress Semiconductor
- Paglalarawan:
- IC 64M FLASH MEMORY
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18002 Pieces
- Data sheet:
- S27KL0641DABHA020.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa S27KL0641DABHA020, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa S27KL0641DABHA020 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier aparato Package: | 24-FBGA (6x8) |
| bilis: | 100MHz |
| serye: | Automotive, AEC-Q100, HyperRAM™ KL |
| packaging: | Tray |
| Package / Kaso: | 24-VBGA |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Type memory: | Volatile |
| Size memory: | 64Mb (8M x 8) |
| memory Format: | DRAM |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | S27KL0641DABHA020 |
| interface: | Parallel |
| paglalarawan: | IC 64M FLASH MEMORY |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa S27KL0641DABHA020
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
S27KL0641DABHV023 | Cypress Semiconductor Corp | IC DRAM 64MBIT 3V 100MHZ 24BGA | Pagtatanong |
|
S27KL0641DABHI023 | Cypress Semiconductor Corp | IC DRAM 64MBIT 3V 100MHZ 24BGA | Pagtatanong |
|
S27KL0641DABHV020 | Cypress Semiconductor Corp | IC DRAM 64MBIT 3V 100MHZ 24BGA | Pagtatanong |
|
S27KL0641DABHI020 | Cypress Semiconductor Corp | IC DRAM 64MBIT 3V 100MHZ 24BGA | Pagtatanong |
|
S27KL0641DABHB020 | Cypress Semiconductor Corp | IC 64M FLASH MEMORY | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers