Bumili SAA-XC866-4FRA 5V BE sa BYCHPS
Bumili na may garantiya
SAA-XC866-4FRA 5V BE
- Numero ng Bahagi:
- SAA-XC866-4FRA 5V BE
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- IC MCU 8BIT 16KB FLASH 38TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14948 Pieces
- Data sheet:
- SAA-XC866-4FRA 5V BE.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SAA-XC866-4FRA 5V BE, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SAA-XC866-4FRA 5V BE sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply (Vcc / Vdd): | 2.3 V ~ 5.5 V |
|---|---|
| Supplier aparato Package: | 38-TSSOP |
| bilis: | 86MHz |
| serye: | XC8xx |
| RAM Size: | 768 x 8 |
| Type Program Memory: | FLASH |
| Size Program Memory: | 16KB (16K x 8) |
| Peripherals: | Brown-out Detect/Reset, POR, PWM, WDT |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 38-TFSOP (0.173", 4.40mm Width) |
| Ibang pangalan: | AX8664FRABEXT SAA-XC866-4FRA BE SAA-XC866-4FRA5VBEINTR SAA-XC866-4FRABEINTR SAA-XC866-4FRABEINTR-ND SAAXC8664FRA5VBE SP000281792 XC8664FRA5VBEAXUMA1 |
| Type osileytor: | Internal |
| operating Temperature: | -40°C ~ 140°C (TA) |
| Bilang ng I / O: | 27 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 26 Weeks |
| Manufacturer Bilang Bahagi: | SAA-XC866-4FRA 5V BE |
| Ang pinalawak Paglalarawan: | XC800 XC8xx Microcontroller IC 8-Bit 86MHz 16KB (16K x 8) FLASH 38-TSSOP |
| EEPROM Size: | - |
| paglalarawan: | IC MCU 8BIT 16KB FLASH 38TSSOP |
| data Converters: | A/D 8x10b |
| core Size: | 8-Bit |
| core Processor: | XC800 |
| Connectivity: | SSI, UART/USART |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SAA-XC866-4FRA 5V BE
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers