Bumili SCMT32C755MRBA0 sa BYCHPS
Bumili na may garantiya
SCMT32C755MRBA0
- Numero ng Bahagi:
- SCMT32C755MRBA0
- Manufacturer:
- AVX Corporation
- Paglalarawan:
- CAPACITOR 7.5F 20% 5V THRU HOLE
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17228 Pieces
- Data sheet:
- SCMT32C755MRBA0.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SCMT32C755MRBA0, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SCMT32C755MRBA0 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | 5V |
|---|---|
| pagpapaubaya: | ±20% |
| pagwawakas: | PC Pins |
| Sukat / Dimension: | 0.984" L x 0.492" W (25.00mm x 12.50mm) |
| serye: | SMC |
| packaging: | Bulk |
| Package / Kaso: | Radial, Can |
| operating Temperature: | -40°C ~ 65°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 3 Weeks |
| Manufacturer Bilang Bahagi: | SCMT32C755MRBA0 |
| Lifetime @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | 0.709" (18.00mm) |
| Taas - Makaupo (Max): | 1.319" (33.50mm) |
| Ang pinalawak Paglalarawan: | 7.5F ±20%(EDLC) Supercapacitor 5V Radial, Can 55 mOhm @ 1MHz 1000 Hrs @ 65°C |
| ESR (Katumbas Series pagtutol): | 55 mOhm @ 1MHz |
| paglalarawan: | CAPACITOR 7.5F 20% 5V THRU HOLE |
| kapasidad: | 7.5F |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SCMT32C755MRBA0
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
MAL219612104E3 | Vishay BC Components | CAP 100MF -20%, +80% 5.5V T/H | Pagtatanong |
 |
BCAP1500 P270 K05 | Maxwell Technologies Inc. | CAP 1500F 2.7V WELD | Pagtatanong |
 |
HV0820-2R7305-AP | Eaton | CAP 3F -10% +30% 2.7V T/H | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers