Bumili SLA5201 sa BYCHPS
Bumili na may garantiya
SLA5201
- Numero ng Bahagi:
- SLA5201
- Manufacturer:
- Sanken Electric Co., Ltd.
- Paglalarawan:
- MOSFET 3N/3P-CH 600V 7A 15-SIP
- Lead Free Status / Katayuan ng RoHS:
- Lead libre sa pamamagitan ng exemption / RoHS compliant
- Magagamit na Dami:
- 16114 Pieces
- Data sheet:
- SLA5201.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SLA5201, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SLA5201 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | - |
|---|---|
| Supplier aparato Package: | 15-SIP |
| serye: | - |
| Rds On (Max) @ Id, Vgs: | - |
| Power - Max: | - |
| packaging: | Tube |
| Package / Kaso: | 15-SIP, Exposed Tab, Formed Leads |
| Ibang pangalan: | SLA5201 DK |
| operating Temperature: | - |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | SLA5201 |
| Input Kapasidad (Ciss) (Max) @ Vds: | - |
| Gate Charge (Qg) (Max) @ Vgs: | - |
| Type FET: | 3 N and 3 P-Channel (3-Phase Bridge) |
| FET Tampok: | Standard |
| Ang pinalawak Paglalarawan: | Mosfet Array 3 N and 3 P-Channel (3-Phase Bridge) 600V 7A Through Hole 15-SIP |
| Alisan ng tubig sa Source Boltahe (Vdss): | 600V |
| paglalarawan: | MOSFET 3N/3P-CH 600V 7A 15-SIP |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 7A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SLA5201
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers