Bumili SMBD7000E6327HTSA1 sa BYCHPS
Bumili na may garantiya
SMBD7000E6327HTSA1
- Numero ng Bahagi:
- SMBD7000E6327HTSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Paglalarawan:
- DIODE ARRAY GP 100V 200MA SOT23
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15714 Pieces
- Data sheet:
- SMBD7000E6327HTSA1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SMBD7000E6327HTSA1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SMBD7000E6327HTSA1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Forward (Vf) (Max) @ Kung: | 1.25V @ 150mA |
|---|---|
| Boltahe - DC Reverse (Vr) (Max): | 100V |
| Supplier aparato Package: | PG-SOT23-3 |
| bilis: | Small Signal =< 200mA (Io), Any Speed |
| serye: | - |
| Reverse Recovery Time (trr): | 4ns |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | TO-236-3, SC-59, SOT-23-3 |
| Ibang pangalan: | SMBD 7000 E6327 SMBD7000 SMBD7000E6327 SMBD7000E6327BTSA1 SMBD7000E6327XT SMBD7000INTR SMBD7000INTR-ND SMBD7000XTINTR SMBD7000XTINTR-ND SP000014938 |
| Operating Temperature - Junction: | 150°C (Max) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | SMBD7000E6327HTSA1 |
| Ang pinalawak Paglalarawan: | Diode Array 1 Pair Series Connection Standard 100V 200mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3 |
| Type diode: | Standard |
| diode Configuration: | 1 Pair Series Connection |
| paglalarawan: | DIODE ARRAY GP 100V 200MA SOT23 |
| Current - Reverse pagtagas @ Vr: | 500nA @ 100V |
| Kasalukuyang - Average rectified (Io) (per Diode): | 200mA (DC) |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SMBD7000E6327HTSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers